Google Tensor G6 Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
There are 8 key differences between Google Tensor G6 Chipset Review — Specifications and Benchmarks and Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks.
Key differences
| Google Tensor G6 Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | Google (manufactured by TSMC) | Qualcomm |
| Fabrication | 3nm (TSMC N3P) | 4nm |
| Announced | August 12, 2026 | February 13, 2025 |
| CPU cores | 7 cores | 8 cores |
| Core configuration | 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz | 1x Kryo Prime 2.3GHz + 3x Kryo Gold 2.2GHz + 4x Kryo Silver 1.8GHz |
| Max clock | 4.11 GHz | 2.3 GHz |
| GPU | PowerVR C-Series CXTP-48-1536 | Adreno 810 |
| Wi-Fi | Wi-Fi 7 | Wi-Fi 6/6E |
Google Tensor G6 Chipset Review — Specifications and Benchmarks
Google Tensor G6 powers the entire Pixel 11 lineup with new Arm C1 cores and a MediaTek modem, prioritizing AI over benchmark numbers.
- +Move to Arm's latest C1 cores and Armv9.3-A architecture.
- +Fundamentally upgraded TPU for better AI performance.
- +New MediaTek modem improves heat and battery drain.
- −PowerVR GPU is much weaker than Qualcomm and MediaTek rivals.
- −Unusual 7-core design instead of 8 affected multi-core results.
- −Large gap in synthetic benchmarks compared to flagship Qualcomm chips.
Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks
The Snapdragon 6 Gen 4 delivers a genuine performance leap for the "6-series," with AnTuTu scores up to 894,500 points and Wi-Fi 6E support.
- +Notable performance jump that closes the gap with the older 7-series tier.
- +Excellent thermal stability reaching up to 85% in extended tests.
- +Supports modern Wi-Fi 6/6E and Bluetooth 5.4.
- −Adreno 810 is the weakest tier within the Adreno 800 series.
- −Slightly behind rival Dimensity 7400 in thermal stability.
Full specifications
| Google Tensor G6 Chipset Review — Specifications and Benchmarks | Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | Google (manufactured by TSMC) | Qualcomm |
| Fabrication | 3nm (TSMC N3P) | 4nm |
| Announced | August 12, 2026 | February 13, 2025 |
| Availability | Available | Available |
| CPU | ||
| CPU cores | 7 cores | 8 cores |
| Core configuration | 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz | 1x Kryo Prime 2.3GHz + 3x Kryo Gold 2.2GHz + 4x Kryo Silver 1.8GHz |
| Max clock | 4.11 GHz | 2.3 GHz |
| Architecture | Arm C1 (Lumex), Armv9.3-A | — |
| Graphics & AI | ||
| GPU | PowerVR C-Series CXTP-48-1536 | Adreno 810 |
| NPU | Upgraded TPU (+50% performance) | — |
| AI performance | On-device Gemini Nano support | — |
| Memory & connectivity | ||
| Supported RAM | — | LPDDR5/LPDDR4X |
| Supported storage | — | UFS 3.1 |
| Modem | MediaTek M90 | — |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 7 | Wi-Fi 6/6E |
| Bluetooth | 6.0 | 5.4 |
| Benchmarks | ||
| AnTuTu | Approximately 1.8-2 million | Approximately 764,000-894,500 |
| Geekbench single-core | Approximately 6,115 | Approximately 994 |
| Geekbench multi-core | Approximately 2,436 | Approximately 3082 |
| Extra features | ||
| Key features | First Tensor chip with a MediaTek modem instead of Samsung | — |
| Phones using it | Google Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, Pixel 11 Pro Fold | HONOR X9d |
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