Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
There are 8 key differences between Google Tensor G6 Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks.
ميديا تيك (MediaTek)
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
7.5
Key differences
| Google Tensor G6 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | Google (manufactured by TSMC) | MediaTek |
| Fabrication | 3nm (TSMC N3P) | 4 nm (TSMC N4P) |
| Announced | August 12, 2026 | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| CPU cores | 7 cores | 8 cores |
| Core configuration | 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 4.11 GHz | 3.4 GHz |
| Architecture | Arm C1 (Lumex), Armv9.3-A | ARMv9.2-A, 64-bit |
| GPU | PowerVR C-Series CXTP-48-1536 | Mali-G720 MC8 |
Google Tensor G6 Chipset Review — Specifications and Benchmarks
Google Tensor G6 powers the entire Pixel 11 lineup with new Arm C1 cores and a MediaTek modem, prioritizing AI over benchmark numbers.
- +Move to Arm's latest C1 cores and Armv9.3-A architecture.
- +Fundamentally upgraded TPU for better AI performance.
- +New MediaTek modem improves heat and battery drain.
- −PowerVR GPU is much weaker than Qualcomm and MediaTek rivals.
- −Unusual 7-core design instead of 8 affected multi-core results.
- −Large gap in synthetic benchmarks compared to flagship Qualcomm chips.
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.
- +An all-big-core design that delivers very strong processing performance
- +Top-tier LPDDR5X memory and UFS 4.1 storage
- +Advanced generative AI support via the NPU 880
- −Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
- −Less consistent performance during long gaming sessions
- −Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Full specifications
| Google Tensor G6 Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturing | ||
| Manufacturer | Google (manufactured by TSMC) | MediaTek |
| Fabrication | 3nm (TSMC N3P) | 4 nm (TSMC N4P) |
| Announced | August 12, 2026 | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| Availability | Available | Available |
| CPU | ||
| CPU cores | 7 cores | 8 cores |
| Core configuration | 1x C1-Ultra 4.11GHz + 4x C1-Pro 3.38GHz + 2x C1-Pro 2.65GHz | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 4.11 GHz | 3.4 GHz |
| Architecture | Arm C1 (Lumex), Armv9.3-A | ARMv9.2-A, 64-bit |
| Graphics & AI | ||
| GPU | PowerVR C-Series CXTP-48-1536 | Mali-G720 MC8 |
| GPU clock | — | ~1300–1500 MHz (slight variation between sources) |
| NPU | Upgraded TPU (+50% performance) | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) |
| AI performance | On-device Gemini Nano support | No specific figure announced by MediaTek |
| Memory & connectivity | ||
| Supported RAM | — | LPDDR5X |
| Max RAM | — | Up to 9600 Mbps |
| Supported storage | — | UFS 4.1 |
| Modem | MediaTek M90 | Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 7 | Wi-Fi 6E |
| Bluetooth | 6.0 | 5.4 |
| Benchmarks | ||
| AnTuTu | Approximately 1.8-2 million | ~2,136,906 |
| Geekbench single-core | Approximately 6,115 | ~1,708 – 1,725 |
| Geekbench multi-core | Approximately 2,436 | ~6,297 – 6,860 |
| Extra features | ||
| Key features | First Tensor chip with a MediaTek modem instead of Samsung | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving |
| Phones using it | Google Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, Pixel 11 Pro Fold | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 |
Other comparisons
Google Tensor G6 Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8550 Super Chipset Review — Specifications and Benchmarks
Google Tensor G6 Chipset Review — Specifications and Benchmarks vs Samsung Exynos 1580 Processor Review
Google Tensor G6 Chipset Review — Specifications and Benchmarks vs Qualcomm Snapdragon 6 Gen 4 Chipset Review — Specifications and Benchmarks