Apple A19 Pro Chipset Review — Specifications and Benchmarks vs MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
There are 8 key differences between Apple A19 Pro Chipset Review — Specifications and Benchmarks and MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks.
ميديا تيك (MediaTek)
MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
7.5
Key differences
| Apple A19 Pro Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| Manufacturer | Apple | MediaTek |
| Fabrication | TSMC — N3P (3nm, third generation) | 4 nm (TSMC N4P) |
| Announced | 9 September 2025 | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| CPU cores | 6 cores | 8 cores |
| Core configuration | Two performance cores + four efficiency cores (custom Apple cores) | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 4.26 GHz (performance cores) | 3.4 GHz |
| Architecture | ARM 64-bit (custom Apple design, ARMv9 class) | ARMv9.2-A, 64-bit |
| GPU | Apple A19 Pro GPU — six cores (five in the iPhone Air) with neural accelerators in every core | Mali-G720 MC8 |
Apple A19 Pro Chipset Review — Specifications and Benchmarks
Read the full review →MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks
A very strong chip for everyday and multitasking workloads thanks to its all-big-core design, with excellent memory and storage support for its class. It falls slightly behind the Snapdragon 8s Gen 4 in graphics and long-range wireless connectivity.
- +An all-big-core design that delivers very strong processing performance
- +Top-tier LPDDR5X memory and UFS 4.1 storage
- +Advanced generative AI support via the NPU 880
- −Weaker graphics than its direct rival, the Snapdragon 8s Gen 4
- −Less consistent performance during long gaming sessions
- −Wi-Fi 6E and Bluetooth 5.4 only, not the newer standards (Wi-Fi 7)
Full specifications
| Apple A19 Pro Chipset Review — Specifications and Benchmarks | MediaTek Dimensity 8500 Ultra Chipset Review — Specifications and Benchmarks | |
|---|---|---|
| التصنيع | ||
| Manufacturer | Apple | MediaTek |
| Fabrication | TSMC — N3P (3nm, third generation) | 4 nm (TSMC N4P) |
| Announced | 9 September 2025 | 15 January 2026 (Dimensity 8500 base) — version "Ultra" appeared in March 2026 with Poco X8 Pro |
| Availability | Available | Available |
| المعالج المركزي | ||
| CPU cores | 6 cores | 8 cores |
| Core configuration | Two performance cores + four efficiency cores (custom Apple cores) | 1× Cortex-A725 at 3.4 GHz + 3× Cortex-A725 at 3.2 GHz + 4× Cortex-A725 at 2.2 GHz — an all-big-core design with no efficiency cores |
| Max clock | 4.26 GHz (performance cores) | 3.4 GHz |
| Architecture | ARM 64-bit (custom Apple design, ARMv9 class) | ARMv9.2-A, 64-bit |
| الرسوميات والذكاء الاصطناعي | ||
| GPU | Apple A19 Pro GPU — six cores (five in the iPhone Air) with neural accelerators in every core | Mali-G720 MC8 |
| GPU clock | ~1620 MHz | ~1300–1500 MHz (slight variation between sources) |
| NPU | 16-core Neural Engine (plus neural accelerators in every GPU core) | MediaTek NPU 880 (generative AI, live translation, image generation, mixed-precision INT4 quantisation) |
| AI performance | ~45 TOPS (an estimate; Apple publishes no official figure) | No specific figure announced by MediaTek |
| الذاكرة والاتصال | ||
| Supported RAM | LPDDR5X | LPDDR5X |
| Max RAM | 9600MT/s | Up to 9600 Mbps |
| Supported storage | NVMe (custom Apple storage) | UFS 4.1 |
| Modem | Snapdragon X80 (17 Pro/Pro Max), andApple C1X (iPhone Air) | Integrated 5G-Advanced, theoretical download up to 5.17 Gbps, triple carrier aggregation |
| 5G | Yes | Yes |
| Wi-Fi | Wi-Fi 7 | Wi-Fi 6E |
| Bluetooth | 6.0 | 5.4 |
| نتائج الاختبارات | ||
| AnTuTu | ~2,600,000 (iOS — not directly comparable with Android) | ~2,136,906 |
| Geekbench single-core | ~3,900 | ~1,708 – 1,725 |
| Geekbench multi-core | ~11,000 (on the iPhone 17 Pro Max) | ~6,297 – 6,860 |
| مميزات إضافية | ||
| Key features | Vapour-chamber cooling (Pro/Pro Max), Memory Integrity Enforcement (MIE), hardware ray tracing, ProRes RAW support, the N1 networking chip | Imagiq 1080 image processor with AI zero shutter lag, hardware ray tracing, 4K HDR video at 60 fps, and UltraSave 3.0+ power saving |
| Phones using it | iPhone 17 Pro, iPhone 17 Pro Max, iPhone Air | Poco X8 Pro (globally) — the base Dimensity 8500 is used in the Honor Power 2 and Redmi Turbo 5 |
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